A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation.
Implement a thermal management strategy, such as a heat sink or thermal interface material, to keep the junction temperature below 150°C. Also, ensure proper airflow and avoid blocking the airflow around the device.
A 10uF to 22uF X7R or X5R ceramic capacitor is recommended, placed as close to the VIN pin as possible, to filter the input voltage and reduce noise.
Use a shielded enclosure, keep the ACST1035-7FP away from antennas and other EMI-sensitive components, and ensure proper grounding and decoupling of the device.
The maximum allowed voltage on the EN pin is 6V. Exceeding this voltage may damage the device.