STMicroelectronics recommends a 2-layer PCB with a solid ground plane on the bottom layer and a thermal pad on the top layer connected to the thermal pad of the device. This layout helps to dissipate heat efficiently.
To ensure reliable operation at high temperatures, it is recommended to derate the device's current output and voltage input according to the datasheet's thermal derating curves. Additionally, ensure good thermal conduction between the device and the PCB, and provide adequate airflow or heat sinking.
To minimize EMI and ensure EMC compliance, it is recommended to use a shielded cable for the output, keep the input and output traces as short as possible, and use a common-mode choke or ferrite bead on the input lines. Additionally, ensure the PCB layout is designed to minimize radiation and conducted emissions.
To protect the device from overvoltage and overcurrent, it is recommended to use a voltage regulator or a transient voltage suppressor (TVS) on the input, and a current limiter or a fuse on the output. Additionally, ensure the device is operated within its recommended operating conditions.
To prevent damage, it is recommended to store the device in its original packaging, away from direct sunlight, moisture, and extreme temperatures. Handle the device by the body, avoiding touching the pins or electrical connections. Use an anti-static wrist strap or mat when handling the device.