STMicroelectronics recommends a 2-layer or 4-layer PCB with a solid ground plane and a thermal relief pattern under the IC to ensure optimal thermal performance.
To ensure reliable operation in high-temperature environments, it's essential to follow the recommended thermal design guidelines, use a suitable thermal interface material, and consider derating the device's performance according to the datasheet.
Using a different inductor value or type than recommended may affect the device's performance, efficiency, and stability. It's crucial to follow the recommended inductor specifications to ensure optimal performance and avoid potential issues.
To troubleshoot issues related to the overcurrent protection feature, check the input voltage, output current, and PCB layout for any potential issues. Also, ensure that the device is properly configured and that the overcurrent threshold is set correctly.
To minimize EMI and EMC issues, follow proper PCB layout guidelines, use a shielded inductor, and ensure that the device is properly decoupled. Additionally, consider using EMI filters or shielding on the input and output lines.
A5972D013TR datasheet
by STMicroelectronics
