DSA007612.pdf by Alpha & Omega Semiconductor

Partial File Text Document No. DSMT-0002 Rev. 1 Page: 1/1 PCB Land Design and Surface Mount for DFN2x5 Punched Package Introduction DFN package is a plastic encapsulated package with a copper lead frame substr
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
Price & Stock Find it at Findchips.com

DSA007612.pdf preview

Download Datasheet

User Tagged Keywords

alpha solder paste PROFILE AON5810 AON5812 package

Price & Stock Powered by