DSA0045497.pdf by National Semiconductor

Partial File Text National Semiconductor Application Note 1112 August 2000 CONTENTS Package Construction Key attributes for micro SMD 4, 5, and 8 bump Smallest Footprint Micro SMD Handling Surface Mount Techn
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250 micro solder ball 8 PIN SMD IC 211 AN-1112 BGA-3000 HR 8790 IPC-SM-785 Polycarbonate shaker smd a10 SMD A8 smd ic marking A9 smd marking a7 smd marking A8 top mark smd A9