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    DSA00175949.pdf by Microsemi

    • MXP7001 I N T E G R A T E D P R O D U C T S 10 Gbps GaAs PIN Photo Diode P RODUCTION D ATA S HEET KEY FEATURES DESCRIPTION either bond wire or flip chip configurations. This device
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    MXP7001 VCSEL array, 850nm flip
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