DSA2IH00127106.pdf by Not Available

Partial File Text GENERAL PURPOSE INFORMATION 2. STRUCTURE MINI MOLD Case Materia! Epoxy Lead Material : Fe - Ni Lead Plating M ark in g S u rfa ce Solder Dipping or Solder Plating POWER MINI MOLD
Datasheet Type Scan
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown

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