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Partial File Text ï»¿Microsemi Corp. 1N645-1 thru 1N649-1 FEATURES â¢ Microminiature package. â¢ Voidiess hermetically sealed glass package. â¢ Triple layer passivation. â¢ Metallurgically bonded. â¢ Stand
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Pb Free Unknown
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1N645-1 1N645-1 JAN 1N647-1 1N649-1