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Partial File Text ï»¿fHHTH Microsemii Corp. IMSB05 MSB1MSB2, MSB4â MSB6, MSB8, MSB 10 FEATURES â¢ Dual In-Line subminiature peickage (DIP). â¢ Machine insertable. â¢ Molded epoxy package. â¢ Precise .1-inc
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