Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    DSA0051330.pdf by OKI Electric Industry

    • This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS This document is Chapter 1 of the package information document consisting of 8 chapters in to
    • Original
    • Unknown
    • Unknown
    • Unknown
    • Powered by Findchips

    DSA0051330.pdf preview
    Download Datasheet

    User Tagged Keywords

    BGA 256 PACKAGE thermal resistance DIP42-P-600-2 ED-7401-2 ED730 HQFP208-P-4040-0 ic packages land pattern for TSOP land pattern for TSOP 2 44 PIN land pattern for TSOP 2 54 pin land pattern for TSOP 2 86 land pattern for TSOP 2 86 PIN land pattern for TSOP 56 pin land pattern tsop 66 oki naming QFP 128 bonding qfp 32 land pattern qfp 64 0.4 mm pitch land pattern qfp 64 0.5 mm pitch land pattern QFP 64 Cavity package Reliability Data Plastic Packages QFP Reliability Data Plastic Packages QFP 240 SOJ 44 PCB land TSOP 54 land pattern TSOP 66 pin Package thermal resistance TSOP 86 land pattern

    Newly Added Datasheets | Privacy Policy | Digital Services Act | Contact Us | About Us

    Copyright © 2024.

    Supplyframe Tracking Pixel