DSA0051381.pdf by OKI Electric Industry

Partial File Text Oki's Wafer Level Chip Size Packaging Technology 1 W-CSP 12/02 The Market's Requirement for a New Packaging Technology · The need for increased functionality, smaller device size and lo
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
Price & Stock Find it at Findchips.com

DSA0051381.pdf preview

Download Datasheet

User Tagged Keywords

72 ball w-csp ED-4701 FBGA tray mobile phone oki qfp tray SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY wcsp reliability

Price & Stock Powered by