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    DSASW0043988.pdf by Estek Electronics

    • TYPE 79L24nd CHIP APPEARANCE CHIP SIZE CHIP THICKNESS 3 BONDING PAD DIMENSION SCRIBE LINE WIDTH TOP METAL BACK METAL WAFER SIZ 0,85 0,85 mm 480 20m (or 350(280) 20m) 92 92 m
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    User Tagged Keywords

    79L24
    Supplyframe Tracking Pixel