DSA0057156.pdf

Partial File Text PDF: 2001 Apr 24 Philips Semiconductors Package outline HBGA596: plastic, heatsink ball grid array package; 596 balls; body 40 x 40 x 1.75 mm SOT635-1 B D A D1 ball A1 inde
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown

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MS 034 MS-034 sot635