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DSAH00210877.pdf
by Infineon Technologies
Partial File Text
Application Notes 7.2.3 KP110: Package Information Packaging ยท Mode of delivery: Sawed wafers on adhesive foil in a sealed pack with max. 25 wafer in one pack. The foil is not expanded before
Datasheet Type
Original
RoHS
Unknown
Pb Free
Unknown
Lifecycle
Unknown
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