DSA0057193.pdf

Partial File Text PDF: 2001 Nov 02 Philips Semiconductors Package outline HBGA329: plastic, thermal enhanced ball grid array package; 329 balls; body 31 x 31 x 1.75 mm; heatsink SOT714-1 B D A
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown

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