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    DSA0057193.pdf

    • PDF: 2001 Nov 02 Philips Semiconductors Package outline HBGA329: plastic, thermal enhanced ball grid array package; 329 balls; body 31 x 31 x 1.75 mm; heatsink SOT714-1 B D A
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    DSA0057193.pdf preview

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    MS-034 sot714
    Supplyframe Tracking Pixel