DSA2IH00130178.pdf by Not Available

Partial File Text O K I Semiconductor Packaging Packaging DtP40-P-600-2.54 5 1 .9 8 * 0 .3 (Unit, mm) Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) DIP42-P-6
Datasheet Type Scan
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown

DSA2IH00130178.pdf preview

Download Datasheet

User Tagged Keywords

lead frame QFP SDIP30P-400