DSA00185412.pdf by Fairchild Semiconductor

Partial File Text Fairchild Semiconductor Application Note January 2001 Revised February 2001 Using BGA Packages Introduction Demanding space and weight requirements of personal computing and portable electron
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0.35mm BGA fanout AN-5026 AN500543 AN5026 BGA 0.35mm pitch BGA 0.56mm BGA Package 0.35mm pitch BGA Solder Ball 0.35mm BGA Solder Ball 0.35mm collapse BGA Solder Ball collapse FSTD16211 FSTD32211

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