DSAISS0006707.pdf by Central Semiconductor

Partial File Text PROCESS TRIAC CPQ057 2 Amp, 600 Volt TRIAC Chip PROCESS DETAILS Process GLASS PASSIVATED MESA Die Size 57 x 57 MILS Die Thickness 9.1 MILS MT1 Bonding Pad Area 29 x 17
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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