DSAISS0006721.pdf by Central Semiconductor

Partial File Text PROCESS CPZ28 Zener Diode 0.5 Watt Zener Diode Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 13 x 13 MILS Die Thickness 7.8 MILS Anode Bonding Pad Area 7.0 x 7
Datasheet Type Original
RoHS No
Pb Free No
Lifecycle Active
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Equivalent Parts !
Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

MMBZ5221BLT1 MMBZ5221B-13 CMPZ5221BTR13 MMBZ5221B CMPZ5222BTR

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