DSAZSAA00011528.pdf by NXP Semiconductors

Partial File Text Package outline Hi5 WLCSP6: wafer level chip-size package; 6 bumps; 0.77 x 1.17 x 0.515 mm B A D ball A1 index area A2 A A1 E detail X C e Ãv Ãw b y C A B C
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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