DSASW00296624.pdf

Partial File Text Influence of Solder Microstructure and Oxide Layers on High Frequency Electrical Losses of WL-CSP Pb-free Interconnections Dragos Burlacu, Luu Nguyen* and Jorma Kivilahti Laboratory of Electronics
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown

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