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DSAUD0010718.pdf
by Laird Technologies
Partial File Text
TflexTM 300 Series Thermal Gap Filler Innovative Technology for a Connected World UNIQUE SILICONE GEL OFFERS COMPLIANCY, THERMAL RESISTANCE TflexTM 300, at pressures of 50psi, will deflect
Datasheet Type
Original
RoHS
Unknown
Pb Free
Unknown
Lifecycle
Unknown
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User Tagged Keywords
ASTM 5470 GAP FILLER
D2240
THR-DS-TFLEX-300
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