Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    DSAUD0010718.pdf by Laird Technologies

    • TflexTM 300 Series Thermal Gap Filler Innovative Technology for a Connected World UNIQUE SILICONE GEL OFFERS COMPLIANCY, THERMAL RESISTANCE TflexTM 300, at pressures of 50psi, will deflect
    • Original
    • Unknown
    • Unknown
    • Unknown
    • Find it at Findchips.com

    DSAUD0010718.pdf preview

    Price & Stock Powered by
    Supplyframe Tracking Pixel