DSAFRAZ0010972.pdf by Intel

Partial File Text The Micro Ball Grid Array (µBGA*) Package 15.1 15 Introduction The Micro Ball Grid Array package (µBGA*) is considered a "chip size" package (CSP). A chip size package is generally defined a
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
Price & Stock
Powered by Findchips

DSAFRAZ0010972.pdf preview

Download Datasheet

User Tagged Keywords

28F160 28F160B3 BGA thermal resistance 6x8 intel 28f160 s5 SOP JEDEC tray ubga package