DSA2IH00138044.pdf by Not Available

Partial File Text S U R FA C E M O U N T T E C H N O L O G Y FEATURES: SIZE REDUCTION Significant size reduction. Up to 40% less area is required as compared to thru-the board type components. Surface mount allows
Datasheet Type Scan
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown

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Lead Bottom Brazed Ceramic DIP Hybrid phoenix microwave