DSA0085366.pdf by STMicroelectronics

Partial File Text PRODUCT/PROCESS CHANGE NOTIFICATION PCN CRP/05/1015 SUBSTRATE METALLISATION AND LEAD FREE SOLDER BALLS CHANGE FOR BGA PACKAGES WITH SIZE EQUAL OR BELOW 23X23 Table 1. Change Identification
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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