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DSA00435068.pdf
by Xilinx
Partial File Text
Application Note: Packaging R Implementation and Solder Reflow Guidelines for Pb-Free Packages XAPP427 (v2.2) January 30, 2006 Summary Recent legislative directives and corporate driven
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Original
RoHS
Unknown
Pb Free
Unknown
Lifecycle
Unknown
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BFG95
BGA PROFILING
FFG1148
FFG1152
FFG676
FFG896
FGG256
FGG400
FSG48
Lead Free reflow soldering profile BGA
PQG100
PQG160
PQG208
reflow profile 245
reflow soldering profile BGA
SOG20
XAPP427