DSA0088216.pdf

Partial File Text Lead-free packaging for semiconductor devices E4 presentation Infineon Technologies / ST Microelectronics / Philips Semiconductors / Freescale Semiconductor 24 March 2005 Content 1 2 3
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown

DSA0088216.pdf preview

Download Datasheet

User Tagged Keywords

BGA 40 x 40 mm St BGA and QFP Package freescale BGA Ball Crack bga thermal cycling reliability FeNi42 FQFP208 HTQFP100 HVQFN48 Infineon diffusion solder Lead Free reflow soldering profile BGA P-DSO-12 philips pb-free products semiconductors cross reference SnAgCu SnPb36Ag2 STD-020C VSO56

Price & Stock Powered by