DSA0088606.pdf

Partial File Text Lead-free packaging for semiconductor devices E3 presentation Infineon Technologies / ST Microelectronics / Philips Semiconductors June 2003 Content 1 2 3 4 5 6 7 8 9 Aim of this d
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown

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0.35mm BGA bga thermal cycling reliability Cu OSP FeNi42 FeNi42-leadframe FQFP208 HTQFP100 HVQFN48 Infineon diffusion solder Infineon technology roadmap J-STD-020B JSTD020B Lead Free reflow soldering profile BGA lead-free solder joint reliability thermal cycle LQFP208 reflow temperature bga SnPb36Ag2 VSO56