Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    DSA0088974.pdf

    • Thermal Data SDIP 24 24 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue
    • Original
    • Unknown
    • Unknown
    • Unknown

    DSA0088974.pdf preview

    Price & Stock Powered by Findchips Logo
    Supplyframe Tracking Pixel