Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    DSAEDA00059066.pdf by Bergquist

    • Gap Pad 1000SF ® Thermally Conductive, Silicone-Free Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 1000SF PROPERTY Color • Thermal conductivity: 0.9 W/m-K â
    • Original
    • Unknown
    • Unknown
    • Unknown
    • Powered by Findchips

    DSAEDA00059066.pdf preview

    Supplyframe Tracking Pixel