This site uses third-party website tracking technologies to provide and continually improve our services, and to display advertisements according to users' interests. I agree and may revoke or change my consent at any time with effect for the future.
PROCESS
CPD80V
Switching Diode
High Voltage Switching Diode Chip
PROCESS DETAILS
Process
EPITAXIAL PLANAR
Die Size
16 x 16 MILS
Die Thickness
7.1 MILS
Anode Bonding Pad
