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    DSA00437840.pdf by Central Semiconductor

    • PROCESS CPD92V Schottky Diode High Voltage Schottky Diode Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 9.0 x 9.0 MILS Die Thickness 7.1 MILS Anode Bonding Pad
    • Original
    • No
    • No
    • Obsolete
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