DSAZSAA00016830.pdf by NXP Semiconductors
- Package outline HVQFN36R: plastic thermal enhanced very thin quad flat package; no leads; 36 terminals; resin based; body 5.5 x 4.5 x 0.85 mm A B D SOT1001-1 terminal 1 index area E
- Original
- Unknown
- Unknown
- Unknown
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