DSAZSAA00016837.pdf by NXP Semiconductors

Partial File Text Package outline HLQFN48R: plastic thermal enhanced low profile quad flat package; no leads; 48 terminals; resin based; body 7 x 7 x 1.28 mm A B D SOT1011-1 terminal 1 index area E
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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