DSAZSAA00017560.pdf by NXP Semiconductors

Partial File Text 23A T1 SO SOT123A CRFM4; blister pack packing method; standard product orientation 12NC ending 112 Rev. 1 â 11 October 2012 Packing information 1. Packing method Blister cover ES
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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