DSASW00313244.pdf by ON Semiconductor

Partial File Text MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS DSN2, 0.6x0.3, 0.4P, (0201) CASE 152AA-01 ISSUE O DATE 06 MAY 2009 SCALE 8:1 A B D 2X DIM A A1 b D E e L E 0.06 C 2X
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0201 footprint 152AA-01 marking 2x