DSASW00313446.pdf by ON Semiconductor

Partial File Text MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS QSOP16 CASE 492-01 ISSUE O DATE 03/01/2001 SCALE 4:1 -A- Q R H x 45_ U RAD. 0.013 X 0.005 DP. MAX -BMOLD PIN MARK RAD. 0.00
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