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    DSASW00313513.pdf by ON Semiconductor

    • MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WDFN8 1.6x1.0, 0.4P CASE 511AF-01 ISSUE O 8 DATE 19 AUG 2008 1 SCALE 4:1 L A B D NOTES: 1. DIMENSIONING AND TOLERANCING PER ASM
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