DSASW00313626.pdf by ON Semiconductor

Partial File Text MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WLCSP8, 1.6x1.6 CASE 567CD-01 ISSUE O SCALE 4:1 D PIN A1 REFERENCE È È 2X 0.05 C 2X A 0.05 C DATE 27 JUL 2010 B NOTES
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567CD 567CD-01 wlcsp8 footprint