DSASW00313707.pdf by ON Semiconductor

Partial File Text MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC-24, 300 mils, EXTENDED FOOTPRINT CASE 751BL-01 ISSUE A DATE 18 MAR 2009 SYMBOL 2.35 2.65 A1 0.10 0.30 A2 2.05 2.55
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SOIC24 SOIC24-050-01