DSASW00313752.pdf by ON Semiconductor

Partial File Text MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS DFN8 3x3, (MICRO8 LEADLESS) CASE 846C-01 ISSUE D 1 SCALE 4:1 ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ INDEX AREA 2X 0.15 T T W Y A J AA 8 7
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