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    DSASW00313762.pdf by ON Semiconductor

    • MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS LFCSP8 3x3, 0.5P CASE 932AF-01 ISSUE O DATE 26 MAR 2008 SCALE 2:1 D D1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROL
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