DSAZSAA00018835.pdf by NXP Semiconductors
- Package outline LBGA156: plastic low profile ball grid array package; 156 balls; body 15 x 15 x 1.05 mm A B D SOT700-1 ball A1 index area A A2 A1 E detail X C e1 1/2
- Original
- Unknown
- Unknown
- Unknown
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