DSAZSAA00018843.pdf by NXP Semiconductors

Partial File Text Package outline HBGA329: plastic, thermal enhanced ball grid array package; 329 balls; body 31 x 31 x 1.75 mm; heatsink SOT714-1 B D A D1 ball A1 index area A j A2 A1 E1
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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DSAZSAA00018843.pdf preview Download Datasheet