DSAZSAA00018900.pdf by NXP Semiconductors

Partial File Text Package outline HLQFP256: plastic thermal enhanced low profile quad flat package; 256 leads; body 28 x 28 x 1.4 mm; exposed die pad SOT1128-1 c exposed die pad y X Dh 192 ZE
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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