DSAZSAA00018917.pdf by NXP Semiconductors

Partial File Text Package outline HVQFN32R: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; resin based; body 7 x 7 x 0.8 mm B D SOT1152-1 A terminal 1 index area A
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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