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    DSAZSAA00018943.pdf by NXP Semiconductors

    • Package outline Flanged ceramic package; 2 mounting holes; 4 leads SOT324B D A F 5 D1 U1 B q C w2 M C M H1 1 c 4 L U2 E E1 A L 2 w1 M A M
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    DSAZSAA00018943.pdf preview

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