DSAZSAA00018997.pdf by NXP Semiconductors

Partial File Text Package outline HSQFP208: plastic thermal enhanced shrink quad flat package; 208 leads (lead length 1.3 mm); body 28 x 28 x 3.4 mm; high stand-off height; heatsink SOT431-1 c y X A D
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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