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    DSAFRAZ0016355.pdf by Philips Semiconductors

    • PDF: 2003 Jan 23 Philips Semiconductors Package outline BGA272: plastic ball grid array package; 272 balls; body 27 x 27 x 1.55 mm SOT579-1 B D A D1 ball A1 index area A
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    BGA272 MS-034
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